Structure, method and system for assessing bonding of electrodes in FCB packaging
AssigneeSpansion LLC
InventorsJunichi Kasai, Junji Tanaka, Naomi Masuda
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Abstract
Structures, methods, and systems for assessing bonding of electrodes in FCB packaging are disclosed. In one embodiment, a method comprises mounting a semiconductor chip with a plurality of first electrodes of a first shape to a mounted portion with a second electrode of a second shape, wherein the second shape is different from the first shape, bonding a respective one of the plurality of first electrodes and the second electrode using a first solder bump, generating an X-ray image of the first solder bump, and determining an acceptability of the bonding of the respective one of the plurality of first electrodes and the second electrode based on the X-ray image of the first solder bump.
Claims19
A semiconductor device comprising:
- a semiconductor chip;
- a plurality of first electrodes of a first circular shape formed on a bottom surface of the semiconductor chip;
- a mounted portion having the semiconductor chip mounted thereon;
- a second electrode of a second polygon shape formed on a top surface of the mounted portion, wherein the second polygon shape is different from the first circular shape;
- and
- a first solder bump for bonding a respective one of the plurality of first electrodes and the second electrode, wherein the first solder bump covers entire surfaces of the respective one of the plurality of first electrodes and the second electrode, and wherein the respective one of the plurality of first electrodes is positioned above the second electrode.
A method for manufacturing a semiconductor device, comprising:
- mounting a semiconductor chip with a plurality of first electrodes of a first shape to a mounted portion with a second electrode of a second shape, wherein the second shape is different from the first shape;
- bonding a respective one of the plurality of first electrodes and the second electrode using a first solder bump;
- generating an X-ray image of the first solder bump;
- and
- determining an acceptability of the bonding of the respective one of the plurality of first electrodes and the second electrode based on the X-ray image of the first solder bump.
A semiconductor device manufacturing system, comprising:
- a means for mounting a semiconductor chip with a plurality of first electrodes of a first circular shape to a mounted portion with a second electrode of a second polygon shape, wherein the second polygon shape is different from the first circular shape;
- a means for bonding a respective one of the plurality of first electrodes and the second electrode using a first solder bump, wherein the respective one of the plurality of first electrodes is positioned above the second electrode;
- a means for generating an X-ray image of the first solder bump;
- and
- a means for determining an acceptability of the bonding of the respective one of the plurality of first electrodes and the second electrode based on the X-ray image of the first solder bump.
Dependencies are inferred from the claim text.