Object including a graphic element transferred on a support and method for making such an object
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsAlain Rey, Chrystel Deguet, Laurent Vandroux
Life of this patent
Estimating the term…
Abstract
An object including at least one graphic element, including at least one layer including at least one metal and etched according to a pattern of the graphic element, a first face of the layer being positioned opposite a face of at least one at least partly transparent substrate, a second face, opposite to the first face, of the layer being covered with at least one passivation layer fixed to at least one face of at least one support by wafer bonding and forming with the support a monolithic structure, and the layer including at least at the second face, at least one area including the metal and at least one semiconductor.
Claims19
An object comprising:
- at least one graphic element, including at least one layer including at least one metal and etched according to a pattern of the graphic element, a first face of the layer being positioned opposite a face of at least one at least partly transparent substrate, a second face, opposite to the first face, of the layer being covered with at least one passivation layer fixed to at least one face of at least one support by wafer bonding and forming, with the support, a monolithic structure, and
- the layer further including, at least at the second face, at least one area including the metal and at least one semiconductor.
A method for making an object including at least one graphic element, comprising:
- a) depositing at least one layer including at least one metal above a face of at least one at least partly transparent substrate;
- b) etching the layer according to a pattern of the graphic element;
- c) forming, in the layer, at least at a second face of the layer opposite to a first face of the layer located on the side of the substrate, at least one area including the metal and at least one semiconductor;
- d) depositing at least one passivation layer at least onto the layer including the etched graphic element and onto portions of the face of the substrate not covered by the layer including the etched graphic element;
- and
- e) fixing the passivation layer to at least one face of at least one support by wafer bonding, forming a monolithic structure.
Dependencies are inferred from the claim text.