Semiconductor module

A semiconductor module comprising:

• a single wiring layer having a predetermine pattern;
• a first bump electrode formed integrally with said wiring layer on one face thereof;
• a first circuit element mounted in a state such that an electrode forming surface of said first circuit element is disposed counter to the one face of said wiring layer, an element electrode directly electrically connected to said first bump electrode being provided on the electrode forming surface thereof;
• a second bump electrode formed integrally with said wiring layer on the one face thereof on a periphery of said first circuit element;
• a conductor disposed above said second bump electrode and connected directly electrically to said second bump electrode;
• and
• a second circuit element mounted above said first circuit element in a state such that an electrode forming surface of said second circuit element is disposed counter to the one face of said wiring layer, an element electrode electrically connected to said conductor being provided on the electrode forming surface thereof,
• wherein the distance from a second circuit element side of said conductor to the one face of said wiring layer is larger than the length of protrusion of said first bump electrode.