Helical springs electrical connecting a plurality of packages
AssigneeSamsung Electronics Co., Ltd.
InventorYoung-Hoon Ro
Life of this patent
Estimating the term…
Abstract
A first semiconductor package includes a first substrate, a first semiconductor chip attached to the first substrate, an encapsulant which covers the first semiconductor chip, and conductive elastic members which are embedded in the encapsulant but with parts thereof exposed. A package on package (POP) includes the first semiconductor package and a second semiconductor package stacked in the first semiconductor package. The second semiconductor package includes a second substrate and a second semiconductor chip attached to the second substrate. The exposed parts of the elastic members are electrically connected to the second substrate. The encapsulant of the first package is formed by a molding process while the conductive elastic members are compressed within their elastic limit by the mold.
Claims14
A package on package (POP) comprising:
- a first package which comprises a first substrate having a first insulating substructure and first conductive elements integral with the first insulating substructure, and a first semiconductor chip attached to the first substrate and electrically connected to respective ones of the first conductive elements;
- and
- a second package stacked on and fixed to the first package, and which comprises a second substrate including second insulating substructure and second conductive elements integral with the second insulating substructure, and a second semiconductor chip attached to the second substrate and electrically connected to respective ones of the second conductive elements,
- wherein the first package further comprises an encapsulant which covers the first semiconductor chip, and conductive elastic members which are embedded in the encapsulant, each of the elastic members having a part thereof exposed by the encapsulant and electrically connected to respective ones the first and second conductive elements, wherein the elastic members are helical springs.
A chip package for use as a lower package in a package on package (POP), the chip package comprising:
- a first substrate having a first insulating substructure and conductive elements integral with the first insulating substructure, and a first semiconductor chip attached to the first substrate and electrically connected to the first conductive elements;
- an encapsulant which covers the first semiconductor chip;
- and
- conductive elastic members which are embedded in the encapsulant, each of the elastic members having a part exposed by the encapsulant and electrically connected to respective ones the conductive elements, wherein the elastic members are helical springs.
Dependencies are inferred from the claim text.