Semiconductor device, method of forming the same, and electronic device
AssigneeElpida Memory, Inc.
InventorsHiroyuki Fujishima, Keiyo Kusanagi, Katsumi Sugawara, Koichi Hatakeyama
Life of this patent
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Abstract
A semiconductor device includes a substrate, a stack of semiconductor chips, and a first sealing material. The substrate may include, but is not limited to, a chip mounting area and a higher-level portion. The higher level portion surrounds the chip mounting area. The higher-level portion is higher in level than the chip mounting area. The stack of semiconductor chips is disposed over the chip mounting area. A first sealing material seals the stack of semiconductor chips. The first sealing material is confined by the higher-level portion.
Claims21
A semiconductor device comprising:
- a substrate comprising a chip mounting area and a higher-level portion, the higher level portion surrounding the chip mounting area, the higher-level portion being higher in level than the chip mounting area;
- a stack of semiconductor chips disposed over the chip mounting area, the stack of the semiconductor chips including an uppermost semiconductor chip that is farthest from the substrate;
- a first sealing material that seals the stack of semiconductor chips, the first sealing material being confined by the higher-level portion;
- and
- a second sealing material covering the stack of semiconductor chips and the first sealing material, so that a top surface of the uppermost semiconductor chip is exposed from the second sealing material, the top surface facing away from the substrate.
A semiconductor device comprising:
- a metal substrate having a first flat surface and a confining surface;
- a stack of semiconductor chips disposed over the flat surface via an insulating layer, the stack of the semiconductor chips being electrically insulated from the metal substrate;
- a first sealing material that seals the stack of semiconductor chips, the first sealing material being confined by the confining surface;
- and
- a wiring substrate disposed over the stack of semiconductor chips, the wiring substrate being smaller in size than the metal substrate, the wiring substrate being electrically coupled to the stack of semiconductor chips.
Dependencies are inferred from the claim text.