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US 8,274,141 B2Granted
Semiconductor memory card and semiconductor memory device
AssigneeKabushiki Kaisha Toshiba
InventorsTaku Nishiyama, Tetsuya Yamamoto, Naohisa Okumura, Takuya Futatsuyama
Life of this patent
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Abstract
A semiconductor memory card includes a wiring board having an outer shape where a cut-out portion is provided at a first long-edge. A second surface of the wiring board includes connection pads disposed along a portion except the cut-out portion of the first long-edge. A memory device is mounted on the second surface of the wiring board. The memory device includes electrode pads arranged along a long-edge positioning in a vicinity of the first long-edge of the wiring board, and one-sidedly disposed so as to correspond to disposed positions of the connection pads. A controller device is stacked on the memory device.
Claims16
A semiconductor memory card, comprising:
- a wiring board having an outer shape in rectangular state including a cut-out portion provided at a first long-edge, a first surface including an external connection terminal, and a second surface including connection pads, wherein the cut-out portion has a length parallel to the first long-edge of the wiring board and a width parallel to a first short-edge of the wiring board, the second surface of the wiring board includes a first pad area having a length corresponding to a residual portion except the cut-out portion of the first long-edge and a width corresponding to the width of the cut-out portion, and at least part of the connection pads is disposed in the first pad area along the residual portion of the first long-edge;
- a memory device, mounted on the second surface of the wiring board, including electrode pads one-sidedly arranged to correspond to the connection pads disposed in the first pad area, along a long-edge positioning in a vicinity of the first long-edge of the wiring board;
- a controller device, stacked on the memory device, including electrode pads arranged along at least one outer edge;
- first metal wires electrically connecting the electrode pads of the memory device and the connection pads disposed in the first pad area of the wiring board;
- second metal wires electrically connecting the electrode pads of the controller device and the connection pads of the wiring board;
- and
- a sealing resin layer formed on the second surface of the wiring board to seal the memory device and the controller device together with the first and the second metal wires,
- wherein the first pad area is provided along the residual portion except the cut-out portion of the first long-edge.
5 more elements
A semiconductor memory card, comprising:
- a wiring board having an outer shape in rectangular state including a cut-out portion provided at a first long-edge, a first surface including an external connection terminal, and a second surface including connection pads, wherein the cut-out portion has a length parallel to the first long-edge of the wiring board and a width parallel to a first short-edge of the wiring board, the second surface of the wiring board includes a first pad area having a length corresponding to a residual portion except the cut-out portion of the first long-edge and a width corresponding to the width of the cut-out portion, and at least part of the connection pads is disposed in the first pad area along the residual portion of the first long-edge;
- a memory device group having a plurality of memory devices stacked on the second surface of the wiring board, the memory devices including electrode pads one-sidedly arranged to correspond to the connection pads disposed in the first pad area, along a long-edge positioning in a vicinity of the first long-edge of the wiring board;
- a controller device, stacked on the memory device group, including electrode pads arranged along at least one outer edge;
- first metal wires electrically connecting the electrode pads of the memory devices and the connection pads disposed in the first pad area of the wiring board;
- second metal wires electrically connecting the electrode pads of the controller device and the connection pads of the wiring board;
- and
- a sealing resin layer formed on the second surface of the wiring board to seal the memory device group and the controller device together with the first and the second metal wires.
4 more elements
Dependencies are inferred from the claim text.