Semiconductor device and semiconductor device manufacturing method

A semiconductor device comprising:

• a semiconductor element;
• and
• a substrate on which the semiconductor element is mounted, wherein
• the semiconductor element includes a light receiving portion and a bonding pad on a first surface, and a back surface of the first surface is mounted on the substrate,
• an extraction electrode is formed on a mounting surface of the substrate on which the semiconductor element is mounted,
• the bonding pad and the extraction electrode are connected together by a metal thin wire,
• a first insulation, which exists between the light receiving portion and the bonding pad and surrounds the light receiving portion, is provided on the first surface of the semiconductor element,
• the bonding pad and the metal thin wire are encapsulated with a sealing resin,
• an outer edge of the first insulation is in contact with the sealing resin on the first surface of the semiconductor element,
• an inner wall of the first insulation facing the light receiving portion and surrounding the light receiving portion has a tapered shape in which an opening area gradually expands with an increase in a distance from the first surface of the semiconductor element, the extraction electrode extends to an outer edge of the mounting surface;
• and
• a second insulation is formed surrounding the mounting surface and on the extraction electrode.