Semiconductor integrated circuit device and method of fabricating the same

A semiconductor integrated circuit device comprising:

• a semiconductor substrate;
• multiple wiring layers stacked on the semiconductor substrate with interlayer insulating films interposed therebetween;
• wiring hook-up portions extended from the corresponding wirings in the respective wiring layers;
• contact conductors so buried in the interlayer insulating films as to pass through the wiring hook-up portions for vertically leading wirings of the respective wiring layers;
• and
• multiple cell array layers;
• wherein
• the wiring hook-up portions have different sizes from each other between at least two layers in the wiring layers;
• word lines and bit lines, which cross each other, are alternately stacked to constitute the multiple wiring layers;
• as the wiring hook-up portions, word line hook-up portions and bit line hook-up portions are disposed in a word line hook-up area and a bit line hook-up area, respectively;
• in the multiple cell array layers, nonvolatile memory cells are arranged at cross-points between the adjacent bit lines and word lines;
• and
• the nonvolatile memory cells are resistance charge type ones, in each of which a variable resistance element and a diode are connected in series.