Modular keyboard and manufacturing method thereof

A manufacturing method of a modular keyboard, comprising the steps of:

• providing an upper casing, wherein the upper casing has a first side and a second side corresponding to each other, and the first side has a plurality of press keys;
• providing a lower casing, wherein the lower casing is provided for sealing the second side, and an enclosure space is formed between the lower casing and the upper casing;
• providing an electric conduction element, wherein the electric conduction element is installed on the second side, and disposed in the enclosure space;
• providing a circuit board, wherein the circuit board is installed between the electric conduction element and the lower casing and disposed in the enclosure space;
• and
• combining the upper casing and the lower casing by a supersonic welding technology for sealing the enclosure space;
• wherein the enclosure space has a height equal to a sum of a thickness of the electric conduction element and a thickness of the circuit board.

A modular keyboard comprising:

• an upper casing, having a first side and a second side disposed opposite to each other, wherein the first side has a plurality of press keys, and the upper casing includes a groove;
• a lower casing, for sealing the second side;
• an enclosure space, formed between the lower casing and the upper casing;
• an electric conduction element, installed on the second side, and disposed in the enclosure space;
• and
• a circuit board, installed between the electric conduction element and the lower casing, and disposed in the enclosure space, wherein the groove has a depth equal to a sum of a thickness of the electric conduction element and a thickness of the circuit board.

A modular keyboard comprising:

• an upper casing, having a first side and a second side disposed opposite to each other, wherein the first side includes a plurality of press keys;
• a lower casing, for sealing the second side, wherein the upper casing and the lower casing have corresponding grooves;
• an enclosure space, formed between the lower casing and the upper casing;
• an electric conduction element, installed on the second side, and disposed in the enclosure space;
• and
• a circuit board, installed between the electric conduction element and the lower casing, and disposed in the enclosure space, wherein the corresponding grooves have a total depth equal to a sum of a thickness of the electric conduction element and a thickness of the circuit board.

A manufacturing method of a modular keyboard, the method comprising:

• providing an upper casing, wherein the upper casing has a first side and a second side corresponding to each other, and the first side has a plurality of press keys, the upper casing includes a groove;
• providing a lower casing, wherein the lower casing is provided for sealing the second side, and an enclosure space is formed between the lower casing and the upper casing;
• providing an electric conduction element, wherein the electric conduction element is installed on the second side, and disposed in the enclosure space;
• providing a circuit board, wherein the circuit board is installed between the electric conduction element and the lower casing and disposed in the enclosure space, the groove has a depth equal to a sum of a thickness of the electric conduction element and a thickness of the circuit board;
• and
• combining the upper casing and the lower casing by a supersonic welding technology for sealing the enclosure space.

A manufacturing method of a modular keyboard, the method comprising:

• providing an upper casing, wherein the upper casing has a first side and a second side corresponding to each other, and the first side has a plurality of press keys;
• providing a lower casing, wherein the lower casing is provided for sealing the second side, and an enclosure space formed between the lower casing and the upper casing, the upper casing and the lower casing have corresponding grooves;
• providing an electric conduction element, wherein the electric conduction element is installed on the second side, and disposed in the enclosure space;
• providing a circuit board, wherein the circuit board is installed between the electric conduction element and the lower casing and disposed in the enclosure space, the corresponding grooves have a total depth equal to a sum of a thickness of the electric conduction element and a thickness of the circuit board;
• and
• combining the upper casing and the lower casing by a supersonic welding technology for sealing the enclosure space.