Concentric vias in electronic substrate
AssigneeQUALCOMM Incorporated
InventorArvind Chandrasekraran
Life of this patent
Estimating the term…
Abstract
A multiwall via structure in an electronic substrate having multiple conductive layers. The multiwall via structure includes an outer via coupled to a pair of the conductive layers, an inner via within the outer via and coupled to the same pair of conductive layers, and a dielectric layer between the inner and outer vias. In various embodiments, the pair of conductive layers can be inner conductive layers or outer conductive layers of the electronic substrate. In other embodiments, a method of preparing a multiwall via structure is provided.
Claims12
A multiwall signal carrying via structure in an electronic substrate having multiple conductive layers, comprising:
- an outer via creating a first signal path between a pair of outer conductive layers of the electronic substrate;
- a pair of outer contacts coupling the pair of outer conductive layers of the electronic substrate to the outer via;
- an inner via within the outer via, the inner via creating a second signal path between the pair of outer conductive layers;
- a pair of inner contacts coupling the pair of outer conductive layers to the inner via;
- and
- a dielectric layer between the inner via and the outer via.
An electronic substrate having multiple conductive layers, said substrate comprising a multiwall signal carrying via structure comprising:
- an outer via creating a first signal path;
- a pair of outer contacts coupling a pair of outer conductive layers of the electronic substrate to the outer via;
- an inner via within the outer via, the inner via creating a second signal path;
- a pair of inner contacts coupling the pair of outer conductive layers to the inner via;
- and
- a dielectric layer between the inner via and the outer via.
A method of manufacturing a multiwall signal carrying via structure in a substrate, comprising:
- providing an electronic substrate comprising multiple conductive layers;
- forming a first via to create a first signal path between a pair of outer conductive layers of the electronic substrate;
- forming a pair of outer contacts to couple the pair of outer conductive layers of the electronic substrate to the first via;
- depositing a first dielectric layer within the first via;
- patterning the first dielectric layer;
- forming a second via within the first via and through the first dielectric layer, the second via creating a second signal path between the pair of outer conductive layers;
- and
- forming a pair of inner contacts coupling the pair of outer conductive layers to the second via.
A multiwall signal carrying via structure in an electronic substrate having multiple conductive layers, comprising:
- first means for signaling between a pair of outer conductive layers of the electronic substrate;
- a pair of outer contacts coupling the pair of outer conductive layers of the electronic substrate to the first signaling means;
- second means for signaling between the pair of outer conductive layers, the second signaling means being within the first signaling means;
- a pair of inner contacts coupling the pair of outer conductive layers to the second signaling means;
- and
- an insulating means between the second signaling means and the first signaling means.
Dependencies are inferred from the claim text.