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US 8,273,993 B2Granted
Electronic component module
AssigneesKabushiki Kaisha Toshiba, Toshiba Materials Co., Ltd.
InventorsHiromasa Kato, Takayuki Naba, Noritaka Nakayama
Life of this patent
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Abstract
An electronic component module 1 has a circuit board 2 in which metal plates 5 and 7 are bonded to both surfaces of a ceramic substrate 3, and an electronic component 9 that is bonded to at least one surface of the metal plate 5 and is operable at least 125° C. The electronic component 9 is bonded to the metal plate 5 via a brazing material layer 8 having a higher melting point than a operating temperature of the electronic component 9.
Claims11
An electronic component module, comprising:
- a circuit board including a ceramic substrate having a first principal surface and a second principal surface opposite to the first principal surface, a first metal plate bonded to the first principal surface of the ceramic substrate, and a second metal plate bonded to the second principal surface of the ceramic substrate;
- and
- an electronic component bonded to at least one of the first and the second metal plates via a first brazing material layer, wherein the electronic component is operable at a temperature of at least 125° C.,
- wherein the first brazing material layer is formed of a brazing material having a melting point in a range of 575° C. to 730° C., and the melting point is higher than an operating temperature of the electronic component, and
- wherein a ratio of a thickness of the first metal plate to a thickness of the second metal plate is 50% or more and 200% or less.
2 more elements
Dependencies are inferred from the claim text.