Back to results
US 8,273,992 B2Granted
Wiring board
AssigneeRenesas Electronics Corporation
InventorYoshiaki Sato
Life of this patent
Estimating the term…
Abstract
The wiring board includes: a base material; a copper pattern which is formed in one surface of the base material, and made of a first metal; and a first nickel land and a second nickel land which are formed over the copper pattern in contact with the copper pattern, and made of a second metal having a higher ionization tendency than that of the first metal, wherein a groove reaching the base material is formed in the copper pattern around a region overlapping the first nickel land at least when seen in a plan view.
Claims11
A wiring board comprising:
- a base material;
- a metal pattern which is formed over one surface of said base material, and made of a first metal;
- a first land and a second land which are formed over said metal pattern in contact with said metal pattern, made of a second metal having a higher ionization tendency than that of said first metal, and electrically connected to each other through said metal pattern;
- and
- an insulating film formed over said metal pattern over said one surface of said base material, in which a first opening and a second opening that open respectively over said first land and said second land are formed,
- wherein a groove reaching said base material is formed in said metal pattern around a region overlapping with said first land at least when seen in a plan view.
3 more elements
A wiring board comprising:
- a base material;
- a metal pattern which is formed over one surface of said base material, and made of a first metal;
- and
- a first land and a second land which are formed over said metal pattern in contact with said metal pattern and that are each adapted to receive a respective solder ball mounted thereon, said first land and said second land being made of a second metal having a higher ionization tendency than that of said first metal and being electrically connected to each other through said metal pattern,
- wherein a groove reaching said base material is formed in said metal pattern around a region in which said first land and said metal pattern overlap when seen in a plan view, and
- wherein said metal pattern in said region contacts said metal pattern outside said groove and said first land in said region does not extend outside said groove.
3 more elements
Dependencies are inferred from the claim text.