Flexible flat circuit cable with gapped section

A flexible flat circuit cable, comprising:

• a first flexible circuit substrate, which extends in an extension direction and has a first surface and a second surface;
• a first conductor layer, which is formed on the first surface of the first flexible circuit substrate;
• a second flexible circuit substrate, which has a first surface and a second surface, the second flexible circuit substrate being stacked on the first flexible circuit substrate in an aligned arrangement with the second surface of the second flexible circuit substrate facing the second surface of the first flexible circuit substrate;
• a second conductor layer, which is formed on the first surface of the second flexible circuit substrate;
• an intermediate conductor layer, which is formed on the second surface of the second flexible circuit substrate;
• an insulation layer, which is formed on the intermediate conductor layer;
• a bonding material layer, which is applied to a predetermined section between the insulation layer and the second surface of the first flexible circuit substrate for bonding and positioning the first flexible circuit substrate and the second flexible circuit substrate with respect to each other in such a way to form a gapped segment at sections where no bonding material is applied;
• and
• a cluster section, which is formed of sections of the first flexible circuit substrate and the second flexible circuit substrate within the gapped segment and comprises a plurality of cluster strips that are formed by slitting the first flexible circuit substrate and the second flexible circuit substrate in the extension direction.

A flexible flat circuit cable, comprising:

• a first flexible circuit substrate, which extends in an extension direction and has a first surface and a second surface;
• a first conductor layer, which is formed on the first surface of the first flexible circuit substrate;
• a first insulation layer, which is formed on the first conductor layer;
• a second flexible circuit substrate, which has a first surface and a second surface, the second flexible circuit substrate being stacked on the first flexible circuit substrate in an aligned arrangement with the second surface of the second flexible circuit substrate facing the first surface of the first flexible circuit substrate;
• a second conductor layer, which is formed on the second surface of the second flexible circuit substrate;
• a second insulation layer, which is formed on the second conductor;
• a bonding material layer, which is applied to a predetermined section directly between the second insulation layer of the second flexible circuit substrate and the first insulation layer of the first flexible circuit substrate for bonding and positioning the first flexible circuit substrate and the second flexible circuit substrate with respect to each other in such a way to form a gapped segment at sections where no bonding material is applied;
• and
• a cluster section, which is formed of sections of the first flexible circuit substrate and the second flexible circuit substrate within the gapped segment and comprises a plurality of cluster strips that are formed by slitting the first flexible circuit substrate and the second flexible circuit substrate in the extension direction.