Adhesive composition and adhesion method
AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsYuki Hisha, Kimihiko Yoda, Kazuhiro Oshima
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AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsYuki Hisha, Kimihiko Yoda, Kazuhiro Oshima
Estimating the term…
Disclosed is an adhesive composition having adhesion properties, high-speed curing properties and moisture resistance. Also disclosed is an adhesion method. Specifically disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (C) a compound having an enal structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) the nitrile-butadiene rubber, (B) the (meth)acrylic composition, (D) a compound having an amine structure, and (E) a compound containing copper. Also disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (D) a compound having an amine structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) the nitrile-butadiene rubber, (B) the (meth)acrylic composition, (C) a compound having an enal structure, and (E) a compound containing copper.
A composition comprising:
A composition comprising:
Dependencies are inferred from the claim text.