Curable silicone composition and electronic component

A curable silicone composition comprising at least the following components:

• (A) an epoxy-containing organopolysiloxane component comprising (A2) an epoxy-containing organopolysiloxane represented by the following general formula:
• A-R5—(R42SiO)m R42Si—R5-A
• where R4 represents an optionally substituted monovalent hydrocarbon group that is free of unsaturated aliphatic bonds, R5 is a bivalent organic group, and where A is an organopolysiloxane residue represented by the following average unit formula:
• (XR42SiO1/2)d (SiO4/2)e
• where R4 is the same as defined above;
• and X designates a single bond, a hydrogen atom, a group represented by R4 as defined above, an epoxy-containing monovalent organic group, or an alkoxysilylalkyl group;
• however, at least one X is a single bond, and at least one X is an epoxy-containing monovalent organic group;
• “d” is a positive number;
• “e” is a positive number;
• and “d/e” is a positive number from 0.2 to 4;
• and “m” is an integer equal to or greater than 1;
• (B) a curing agent for an epoxy resin;
• (C) a thermally conductive metal powder;
• and (D) a thermally conductive nonmetal powder, wherein the thermally conductive metal powder is contained in an amount of 10 to 2,000 parts by mass per 100 parts by mass of the sum of components (A) and (B), wherein component (B) is an organosiloxane represented by the following general formula:
• R63SiO (R62SiO)n SiR63
• where R6 is an optionally substituted monovalent hydrocarbon group or a monovalent organic group selected from the group consisting of:
• wherein R7 designates alkylene or alkylenoxyalkylene groups, wherein at least two groups represented by R6 contained in one molecule are the aforementioned monovalent organic groups and with the proviso that at least one R6 at each molecular terminal of component (B) is the aforementioned monovalent organic group, and wherein “n” is an integer from 0 to 1,000.