Method for manufacturing a semiconductor device
AssigneeHynix Semiconductor Inc.
InventorHyung Kyu Kim
Life of this patent
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Abstract
A manufacturing method of a semiconductor device wherein a metal pad is etched to form a trench in which a central part is concave in form, or to form a trench in the shape of a cylinder or a parallelepiped on the edge part of a metal pad. Accordingly, the contact area between a polymide isoindro quirazorindione (PIQ) or similar curable layer and the metal pad is increased and the bondability is improved. Accordingly, the technology of improving the characteristic of device by preventing the problem that the metal pad is excessively opened in a subsequent curing process and the layer of a lower portion of the metal pad is attacked is disclosed.
Claims6
A method for manufacturing a semiconductor device comprising:
- forming a metal pad over a semiconductor substrate, said metal pad comprising edge portions and an interior area bounded by the edge portions;
- forming a trench on a location which is spaced from the edge portions of the metal pad into the interior surface by etching the metal pad, said trench defining a side wall;
- forming a first protection layer on an entire surface including the trench;
- etching the first protection layer whereby the first protection layer remains over the metal pad and on a side wall of the trench;
- forming a curable second protection layer on an entire surface including the etched first protection layer;
- etching the second protection layer whereby the second protection layer remains over the trench;
- curing the second protection layer;
- and
- etching the first and second protection layers to expose the metal pad.
Dependencies are inferred from the claim text.