Soldering method and method of manufacturing semiconductor device including soldering method
AssigneeFuji Electric Co., Ltd.
InventorsKazunaga Onishi, Yoshitaka Nishimura, Tatsuo Nishizawa, Eiji Mochizuki
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Abstract
A soldering method of soldering first and second members includes shooting a laser light to at least one part of an outer peripheral portion surrounding a soldering-target region of the first member thereby to form an oxide film, and bonding the second member with the soldering-target region through a solder. According to the method, the solder resist is never exfoliated even after cleaning with chemicals for removing flux residues contained in solder.
Claims21
A soldering method of soldering a cooling base member made of a first metal material to a second member, the method comprising the steps of:
- forming a solder resist region composed of an oxide film of the first metal material of the cooling base member at at least one part of an outer peripheral portion surrounding a soldering-target region of the cooling base member by selectively shooting a laser light to the at least one part of the outer peripheral portion surrounding the soldering-target region of the cooling base member to thermally oxidize a surface of the cooling base member and form the oxide film of the first metal material;
- and
- bonding the second member to the soldering-target region of the cooling base member using a solder,
- wherein the oxide film has a strongly oxidized region and a weakly oxidized region,
- wherein the strongly oxidized region is positioned bordering the soldering-target region so that the strongly oxidized region is in contact with the soldering-target region.
A method of manufacturing a semiconductor device having a cooling base member made of a first metal material and an insulating board soldered to the cooling base member, the method comprising the steps of:
- forming a solder resist region composed of an oxide film of the first metal material at least one part of an outer peripheral portion surrounding a soldering-target region of the cooling base member by selectively shooting a laser light to the at least one part of the outer peripheral portion surrounding the soldering-target region of the cooling base member to thermally oxidize a surface of the cooling base member and form the oxide film of the first metal material;
- and
- soldering the insulating board to the soldering-target region of the cooling base member,
- wherein the oxide film has a strongly oxidized region and a weakly oxidized region, and
- wherein the strongly oxidized region is positioned bordering the soldering-target region so that the strongly oxidized region is in contact with the soldering-target region.
A soldering method of soldering a cooling base member, which is made of copper and a nickel plating over the copper, to a second member, the method comprising the steps of:
- forming a solder resist region composed of an oxide film of nickel at at least one part of an outer peripheral portion surrounding a soldering-target region of the cooling base member by selectively shooting a laser light to the at least one part of the outer peripheral portion surrounding the soldering-target region of the cooling base member to thermally oxidize a surface of the cooling base member and form the oxide film of nickel;
- and
- bonding the second member to the soldering-target region of the cooling base member using a solder,
- wherein the oxide film of nickel is formed by shooting the laser light to the surface of the cooling base member with energy sufficient only to oxidize the nickel plating without oxidizing the copper therebelow.
Dependencies are inferred from the claim text.