Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsSoo-San Park, Sang-Ho Lee, DaeSik Choi
Life of this patent
Estimating the term…
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole; and forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached.
Claims16
A method of manufacture of an integrated circuit packaging system comprising:
- providing a package carrier having a dispense port;
- attaching an integrated circuit to the package carrier and over the dispense port;
- placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole;
- forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached;
- and
- wherein:
- forming the encapsulation includes injecting the encapsulation through the dispense port, the encapsulation having a cavity partially exposing the integrated circuit.
A method of manufacture, of an integrated circuit packaging system comprising:
- providing a package carrier having a dispense port;
- attaching an integrated circuit to the package carrier with an internal interconnect, the integrated circuit over the dispense port;
- attaching an exposed interconnect to the package carrier;
- placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole;
- and
- forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit and the internal interconnect including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached and a portion of the exposed interconnect exposed from the encapsulation.
An integrated circuit packaging system comprising:
- a package carrier having a dispense port;
- an integrated circuit attached to the package carrier and over the dispense port;
- an encapsulation surrounding the integrated circuit including a space between the integrated circuit and the package carrier, and in a portion of the dispense port, the encapsulation having an elevated portion or a removal surface on a top surface of the encapsulation and resulting from the elevated portion detached;
- and
- wherein:
- the encapsulation has a cavity partially exposing the integrated circuit.
Dependencies are inferred from the claim text.