Manufacturing method for electronic device having IC chip and antenna electrically connected by bridging plate

A method of manufacturing an electronic device that includes (1) an IC chip having two external electrodes, the external electrodes being formed respectively on one and the other of the faces of an opposing pair of faces of the IC chip, (2) a transmission and reception antenna having a slit formed therein, and (3) a bridging plate that electrically connects the IC chip and the antenna, the transmission and reception antenna being on a base substrate, the method comprising:

• arranging a plurality of IC chips in at least one of a longitudinal orientation or a horizontal orientation;
• positionally aligning at least one of the plurality of IC chips at a position corresponding to a determined position on an antenna circuit on which the at least one of the plurality of IC chips is being mounted, the at least one of the plurality of IC chips being positioned onto an anisotropic conductive adhesive layer;
• and
• performing thermal compression bonding that joins the bridging plate on the transmission and reception antenna such that the bridging plate spans the slit and electrically connects the IC chip and the antenna.

A method of manufacturing an electronic device that includes (1) an IC chip having two external electrodes, the external electrodes being formed respectively on one and the other of the faces of an opposing pair of faces of the IC chip, (2) a transmission and reception antenna having a slit formed therein, the transmission and reception antenna being on a base substrate, and (3) a bridging plate that electrically connects the IC chip and the antenna, the method comprising:

• forming a plurality of antenna circuits that include a first metallic film and forming an antenna substrate by disposing the antenna circuits on the base substrate;
• or forming an antenna substrate by providing a plurality of antenna circuits, by etching, from the first metallic film deposited on the base substrate;
• arranging a plurality of the IC chips in at least one of a longitudinal orientation or a horizontal orientation, with a same interval therebetween as is required when the plurality of the IC chips are arranged in determined positions with respect to corresponding circuits of the plurality of antenna circuits that the plurality of the IC chips are to be mounted upon;
• securing the plurality of IC chips at once, to bridging plates having a second metallic film formed thereon via a first anisotropic conductive adhesive layer such that the plurality of the IC chips thus arranged are electrically connected, thereby producing bridging plates with the IC chips attached;
• positionally aligning the bridging plates with IC chips attached in the determined positions on the plurality of antenna circuits, such that the plurality of the IC chips are electrically connected;
• and
• performing thermal compression bonding that joins the bridging plates with IC chips attached at once in the determined positions on the antenna substrate via a second anisotropic conductive adhesive layer, such that the bridging plate spans the slit and electrically connects the IC chip and the antenna.

A method of manufacturing an electronic device that includes (1) an IC chip having two external electrodes, the external electrodes being formed respectively on one and the other of the faces of an opposing pair of faces of the IC chip, (2) a transmission and reception antenna having a slit formed therein, the transmission and reception antenna being on a base substrate, and (3) a bridging plate that electrically connects the IC chip and the antenna, the method comprising:

• forming a plurality of antenna circuits that include a first metallic film and forming an antenna substrate by disposing the antenna circuits on a base substrate;
• or forming the antenna substrate by providing a plurality of antenna circuits, by etching, from the first metallic film deposited on the base substrate;
• arranging in at least one of a longitudinal orientation or a horizontal orientation, a plurality of the IC chips, with a same interval therebetween as is required when the plurality of the IC chips are arranged in determined positions with respect to the corresponding circuits of the plurality of antenna circuits that the plurality of the IC chips are to be mounted upon;
• tentatively securing the IC chips, via a first anisotropic conductive adhesive layer, after the plurality of the arranged IC chips have been positionally aligned at once, such that the plurality of the IC chips are electrically connected in the determined positions with respect to the corresponding circuits of the plurality of antenna circuits that the plurality of the IC chips are mounted upon;
• positionally aligning the tentatively secured plurality of IC chips with bridging plates having a second metallic film so as to be electrically connected in the determined position on an antenna circuit;
• and
• performing thermal compression bonding that joins the bridging plates at once on the plurality of the IC chips and the antenna substrate, via a second anisotropic conductive adhesive layer such that the bridging plate spans the slit and electrically connects the IC chip and the antenna.

A method of manufacturing an electronic device that includes (1) an IC chip having two external electrodes, the external electrodes being formed respectively on one and the other of the faces of an opposing pair of faces of the IC chips, (2) a transmission and reception antenna having a slit formed therein, the transmission and reception antenna being on a base substrate, and (3) a bridging plate that electrically connects the IC chip and the antenna, the method comprising:

• forming a plurality of antenna circuits that include a first metallic film and forming an antenna substrate by disposing the antenna circuits on a base substrate;
• or forming the antenna substrate by providing a plurality of antenna circuits, by etching, from the first metallic film deposited on the base substrate;
• forming a first anisotropic conductive adhesive layer in a determined position on an antenna circuit of the plurality of antenna circuits;
• arranging in at least one of a longitudinal orientation or a horizontal orientation, a plurality of the IC chips, with a same interval therebetween as is required when the plurality of the IC chips are arranged in determined positions with respect to the corresponding circuits of the plurality of antenna circuits that the plurality of the IC chips are to be mounted upon, the plurality of the IC chips being arranged on the first anisotropic conductive adhesive layer;
• tentatively securing the IC chips, after the plurality of the IC chips arranged on the first anisotropic conductive adhesive layer have been positionally aligned at once, such that the plurality of the IC chips are electrically connected in the determined positions with respect to the corresponding circuits of the plurality of antenna circuits that the plurality of IC chips are mounted upon;
• forming a second anisotropic conductive adhesive layer in determined positions on the plurality of IC chips thus tentatively secured and the antenna circuits;
• positionally aligning the tentatively secured plurality of IC chips with bridging plates having a second metallic film so as to be electrically connected in the determined position on an antenna circuit;
• and
• performing thermal compression bonding that joins the bridging plates at once on the plurality of the IC chips and the antenna substrate such that the bridging plate spans the slit and electrically connects the IC chip and the antenna.