Interposers, electronic modules, and methods for forming the same
AssigneeThe Charles Stark Draper Laboratory, Inc.
InventorsLivia M. Racz, Gary B. Tepolt, Jeffrey C. Thompson, Thomas A. Langdo, Andrew J. Mueller
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Abstract
In accordance with a method for forming an interposer, a fill hole is formed in a first side of a substrate and a cavity is formed in a second side. The cavity is in fluidic communication with the fill hole. A plurality of posts is formed in the cavity, and an encapsulant is injected through the fill hole into the cavity to encapsulate the plurality of posts. In accordance with a method of thermal management, an electronic component and a heat sink are disposed on opposing sides of an interposer that includes a plurality of encapsulated posts.
Claims15
A method for forming an interposer, the method comprising:
- forming a fill hole in a first side of a substrate and a cavity in a second side of the substrate, the cavity being in fluidic communication with the fill hole;
- forming a plurality of posts in the cavity;
- and
- injecting an encapsulant through the fill hole into the cavity to encapsulate the plurality of posts within the cavity without encapsulating any active electronic components within the cavity.
A method of thermal management, the method comprising:
- disposing an electronic component and a heat sink on opposing sides of an interposer, the interposer comprising a substrate with a plurality of posts, each post (i) made from the same material as the substrate, (ii) at least partially encapsulated by an encapsulant material, and (iii) having been formed from the substrate.
Dependencies are inferred from the claim text.