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US 8,273,520 B2Granted
Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same
AssigneeFUJIFILM Corporation
InventorAtsushi Sugasaki
Life of this patent
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Abstract
The present invention provides a resin composition for laser engraving containing at least an acetylene compound and a binder polymer, a relief printing plate precursor for laser engraving using the same, a relief printing plate, and a method for producing a relief printing plate.
Claims7
A relief printing plate precursor for laser engraving, comprising:
- a relief forming layer including a resin composition, the resin composition comprising:
- an acetylene compound;
- a binder polymer;
- a polymerizable compound;
- and
- a photothermal conversion agent which is capable of absorbing light in a wavelength range of 700 to 1300 nm, wherein the photothermal conversion agent comprises carbon black,
- wherein each of the acetylene compound, the binder polymer, the polymerizable compound and the photothermal conversion agent is a different component of the resin composition, and
- wherein the acetylene compound includes a carbon-carbon triple bond positioned at an end of a molecule of the acetylene compound or two carbon-carbon triple bonds positioned at an interior of a molecule of the acetylene compound.
5 more elements
Dependencies are inferred from the claim text.