# US 8,273,458 B2 · Adhesive for bonding circuit members, circuit board and process for its production

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 8,273,458 B2
- Document ID: US8273458B2
- Status: Granted
- Kind: B2
- Application number: 13/166,591
- Filed: 2011-06-22
- Published: 2011-10-13
- Granted: 2012-09-25
- Earliest claimed: 1997-02-14
- Assignees: Hitachi Chemical Company, Ltd.
- Inventors: Itsuo Watanabe; Kenzo Takemura; Akira Nagai; Kazuhiro Isaka; Osamu Watanabe; Kazuyoshi Kojima
- Web page: https://patentgrep.com/patent/US8273458B2

## CPC

- C09J 9/02: Electrically-conducting adhesives
- H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion}
- H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads}
- H10W 70/666: {Organic materials or pastes}
- H10W 72/00: Interconnections or connectors in packages
- H05K 2201/0133: Elastomeric or compliant polymer
- H05K 2201/0209: Inorganic, non-metallic particles
- H05K 2201/0379: Stacked conductors
- H05K 2203/1189: Pressing leads, bumps or a die through an insulating layer
- H10W 72/073: {of die-attach connectors}
- H10W 72/07331: {Connecting techniques}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/354: {comprising polymers}
- H10W 72/5522: {comprising gold [Au]}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/49117: Conductor or circuit manufacturing
- Y10T 156/10: Methods of surface bonding and/or assembly therefor
- Y10T 156/109: Embedding of laminae within face of additional laminae
- Y10T 428/24942: including components having same physical characteristic in differing degree
- Y10T 428/24959: of adhesive layers
- Y10T 428/2852: Adhesive compositions
- Y10T 428/31511: Of epoxy ether
- Y10T 428/31515: As intermediate layer
- Y10T 428/31855: Of addition polymer from unsaturated monomers
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

## Claims

### Claim 1

A circuit board comprising:
a first circuit member having a first connecting terminal; and
a second circuit member having a second connecting terminal,
the first connecting terminal and the second connecting terminal being disposed facing each other, and an adhesive being put between the first connecting terminal and the second connecting terminal which are facing each other; and
the first connecting terminal and the second connecting terminal disposed facing each other being electrically interconnected by pressing,
wherein the adhesive comprises:
one adhesive layer; and
another adhesive layer having a glass transition temperature of 120° C. or above, which is higher than that of the one adhesive layer;
the adhesive being disposed in such a way that the another adhesive layer is applied on the side of one of said circuit members which has a higher modulus of elasticity than the other, and the one adhesive layer is applied on the side of the other circuit member having a lower modulus of elasticity.

### Claim 2

A circuit board comprising:
a first circuit member having a first connecting terminal; and
a second circuit member having a second connecting terminal,
the first connecting terminal and the second connecting terminal being disposed facing each other, and an adhesive being put between the first connecting terminal and the second connecting terminal which are facing each other,
the first connecting terminal and the second connecting terminal disposed facing each other being electrically interconnected by pressing,
wherein the adhesive comprises:
one adhesive layer; and
another adhesive layer having a glass transition temperature of 120° C. or above, which is higher than that of the one adhesive layer,
the adhesive being disposed in such a way that the another adhesive layer is applied on the side of one of said circuit members which has a smaller coefficient of thermal expansion than that of the other, and the one adhesive layer is applied on the side of the other circuit member having a larger coefficient of thermal expansion.

### Claim 3

A circuit board comprising:
an inorganic insulating substrate having a first connecting terminal; and
an organic insulating substrate having a second connecting terminal,
the first connecting terminal and the second connecting terminal being disposed facing each other, and an adhesive being put between the first connecting terminal and the second connecting terminal which are facing each other,
the first connecting terminal and the second connecting terminal disposed facing each other being electrically interconnected by pressing,
wherein the adhesive comprises:
one adhesive layer; and
another adhesive layer having a glass transition temperature of 120° C. or above, which is higher than that of the one adhesive layer;
the adhesive being disposed in such a way that the another adhesive layer is applied on the side of the inorganic insulating substrate, and the one adhesive layer is applied on the side of the organic insulating substrate.

### Claim 4

A process for producing a circuit board, comprising steps of:
(a) disposing a first circuit member having a first connecting terminal and a second circuit member having a second connecting terminal, in such a way that the first connecting terminal and the second connecting terminal face each other,
said circuit members being so disposed that an adhesive is put between the first connecting terminal and the second connecting terminal which have been disposed facing each other,
wherein the adhesive comprises:
one adhesive layer; and
another adhesive layer having a glass transition temperature of 120° C. or above, which is higher than that of the one adhesive layer;
the adhesive being disposed in such a way that the another adhesive layer is applied on the side of one of said circuit members which has a higher modulus of elasticity than that of the other, and the one adhesive layer is applied on the side of the other circuit member having a lower modulus of elasticity; and
(b) pressing the resultant circuit members to electrically interconnect the first connecting terminal and the second connecting terminal disposed facing each other.

### Claim 5

A process for producing a circuit board, comprising steps of:
(a) disposing a first circuit member having a first connecting terminal and a second circuit member having a second connecting terminal, in such a way that the first connecting terminal and the second connecting terminal face each other,
said circuit members being so disposed that an adhesive is put between the first connecting terminal and the second connecting terminal which have been disposed facing each other,
wherein the adhesive comprises:
one adhesive layer; and
another adhesive layer having a glass transition temperature of 120° C. or above, which is higher than that of the one adhesive layer;
the adhesive being disposed in such a way that the another adhesive layer is applied on the side of one of said circuit members which has a smaller coefficient of thermal expansion than that of the other, and the one adhesive layer is applied on the side of the other circuit member having a larger coefficient of thermal expansion; and
(b) pressing the resultant circuit members to electrically interconnect the first connecting terminal and the second connecting terminal disposed facing each other.

### Claim 6

A process for producing a circuit board, comprising steps of:
(a) disposing an inorganic insulating substrate having a first connecting terminal and an organic insulating substrate having a second connecting terminal, in such a way that the first connecting terminal and the second connecting terminal face each other,
said insulating substrates being so disposed that an adhesive is put between the first connecting terminal and the second connecting terminal which have been disposed facing each other,
wherein the adhesive comprises:
one adhesive layer, and
another adhesive layer having a glass transition temperature of 120° C. or above, which is higher than that of the one adhesive layer,
the adhesive being disposed in such a way that the another adhesive layer is applied on the side of the inorganic insulating substrate, and the one adhesive layer is applied on the side of the organic insulating substrate; and
(b) pressing the resultant insulating substrates to electrically interconnect the first connecting terminal and the second connecting terminal disposed facing each other.