Two-part thermocurable polyimide resin composition and cured product thereof
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsMasahito Ohkido, Wataru Ueno, Jitsuo Oishi, Shuta Kihara
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AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsMasahito Ohkido, Wataru Ueno, Jitsuo Oishi, Shuta Kihara
Estimating the term…
It relates to a highly heat resistant thermosetting polyimide resin composition that is cured at a temperature of 150° C. or less, and provides a cured product that generates a less amount of decomposed gas even under heating to 250° C., and has flexibility and adhesiveness. A two-component thermosetting polyimide resin composition containing a liquid A containing a polyimide (a) having a main chain constituted by a repeating unit having a polyoxyalkylenediamine structure with amino groups on both ends thereof, and a liquid B containing a bismaleimide compound, and a cured product of a thermosetting polyimide resin composition obtained by mixing these two liquids and curing the mixture under heating.
A two-component thermosetting polyimide resin composition comprising:
A liquid polyimide which is produced by mixing a tetracarboxylic acid component containing at least one compound selected from a tetracarboxylic dianhydride represented by formula (1), a tetracarboxylic acid and a derivative of the tetracarboxylic acid represented by formula (2), with a polyoxyalkylenediamine represented by formula (3) in such a manner that a number of moles of the polyoxyalkylenediamine is from 1.01 to 2 times the number of moles of the tetracarboxylic acid component, and by being subjected to reaction of the mixture under heating:
Dependencies are inferred from the claim text.