US 8,273,431 B2Granted

Polyamide resin composition

AssigneeMitsubishi Gas Chemical Company, Inc.

InventorsRyoji Otaki, Jun Mitadera, Tomonori Kato, Tomomichi Kanda

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Abstract

A polyamide resin composition contains a resin component containing at least a polyamide (X) and a fatty acid metallic salt having from 10 to 50 carbon atoms, and contains arbitrarily an additive (A) and/or an additive (B). The polyamide (X) is obtained through melt polycondensation of a diamine component containing 70% by mol or more of m-xylylenediamine and a dicarboxylic acid component containing 70% by mol or more of an α,ω-linear aliphatic dicarboxylic acid. The additive (A) is at least one compound selected from the group consisting of a diamide compound obtained from a fatty acid having from 8 to 30 carbon atoms and a diamine having from 2 to 10 carbon atoms, a diester compound obtained from a fatty acid having from 8 to 30 carbon atoms and a diol having from 2 to 10 carbon atoms, and a surfactant, and the additive (B) is at least one compound selected from the group consisting of a metallic hydroxide, a metallic acetate salt, a metallic alkoxide, a metallic carbonate salt and a fatty acid.

Claims24

Dependent claims

A polyamide resin composition comprising:

a resin component containing a polyamide (X) obtained through melt polycondensation of a diamine component containing 70% by mol or more of m-xylylenediamine and a dicarboxylic acid component containing 70% by mol or more of an α,ω-linear aliphatic dicarboxylic acid, and
a fatty acid metallic salt having from 10 to 50 carbon atoms,
wherein the polyamide (X) has been obtained through melt polycondensation of the diamine component and the dicarboxylic acid component in the presence of both a phosphorus atom-containing compound and an alkali metal compound (C),
the polyamide (X) contains the phosphorus atom-containing compound in a concentration of from 50 to 400 ppm in terms of phosphorus atom, and has a ratio represented by an expression:
M1/M2
(in the expression, M1 represents the total molar number of the fatty acid metallic salt in the polyamide resin composition, and M2 represents the molar number of the phosphorus atom-containing compound in the polyamide resin composition) of from 0.05 to 0.5, and
a ratio (molar number of the alkali metal compound (C))/(molar number of the phosphorus atom-containing compound) is from 0.5 to 1.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/302,335Filed 31 May 2007
Priority: JP 2006-15166331 May 2006
Published: US 2009/0239013 A124 Sep 2009
Granted: 25 Sep 2012
Term ends: Not estimatedThe source records don’t support an estimate.

Classification31 codes

C08K 5/0008
Use of organic ingredients: organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
B29B 9/12
Making granules: characterised by structure or composition
B32B 27/08
As the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin
B32B 27/32
Layered products comprising a layer of synthetic resin: comprising polyolefins