Method for etching glass substrate
AssigneeAsahi Glass Company, Limited
InventorsYoshitaka Saijo, Yuichi Suzuki, Ryoji Akiyama, Atsuyoshi Takenaka, Junichiro Kase
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Abstract
The invention provides a method for etching which is intended for reducing the thickness of a glass substrate, and which attains a high etching rate and is capable of inhibiting haze generation on the glass substrate surface. The invention relates to a method for etching a glass substrate surface, comprising etching the glass substrate surface in an amount of 1-690 μm in terms of etching amount, in which the etching is conducted with an etchant having an HF concentration of 1-5 wt % and an HCl concentration of 1 wt % or higher.
Claims11
A method for etching a glass substrate surface, comprising:
- etching a surface of a glass substrate in an etching amount of 1-690 μm,
- wherein the etching comprises applying an etchant having an HF concentration of 1-5 wt % and an HCl concentration of 1 wt % or higher, the glass substrate comprises 50 to 66% by mass of SiO2, 10.5 to 22% by mass of Al2O3, 5 to 12% by mass of B2O3, 0 to 8% by mass of MgO, 0 to 14.5% by mass of CaO, 0 to 24% by mass of SrO, and 0 to 13.5% by mass of BaO, and a sum of MgO, CaO, SrO and BaO in the glass substrate is 9 to 29.5% by mass.
Dependencies are inferred from the claim text.