# US 8,273,256 B2 · Method for manufacturing wiring structure of wiring board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,273,256 B2 - Document ID: US8273256B2 - Status: Granted - Kind: B2 - Application number: 12/793,560 - Filed: 2010-06-03 - Published: 2011-06-23 - Granted: 2012-09-25 - Earliest claimed: 2009-12-22 - Assignees: Unimicron Technology Corp. - Inventors: Shu-Sheng Chiang; Tsung-Yuan Chen; Wei-Ming Cheng - Web page: https://patentgrep.com/patent/US8273256B2 ## CPC - B32B 38/04: Punching, slitting or perforating - C23C 18/1608: {from pretreatment step, i.e. selective pre-treatment} - C23C 18/1653: {Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating} - C23C 18/1831: {Use of metal, e.g. activation, sensitisation with noble metals} - C23C 18/31: Coating with metals - H05K 3/107: {by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence)} - B32B 2311/00: Metals, their alloys or their compounds - B32B 2457/08: PCBs, i.e. printed circuit boards - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A method for manufacturing a wiring structure of a wiring board is provided. In the method, a substrate including an insulation layer and a film disposed on the insulation layer is provided. Next, a barrier layer completely covering the film is formed. Next, an intaglio pattern partially exposing the insulation layer is formed on an outer surface of the barrier layer. Next, an activated layer is formed on the outer surface and in the intaglio pattern. Then, the activated layer on the outer surface is removed, and the activated layer in the intaglio pattern is remained. After the activated layer on the outer surface is removed, a conductive material is formed in the intaglio pattern by using a chemical deposition method. After forming the conductive material, the barrier layer and the film are removed. ## Claims ### Claim 1 A method for manufacturing a wiring structure of a wiring board, comprising: providing a substrate comprising an insulation layer and a film disposed on the insulation layer, wherein the film completely covers the insulation layer; forming a barrier layer completely covering the film, wherein the barrier layer has an outer surface; forming an intaglio pattern partially exposing the insulation layer on the outer surface; forming an activated layer on the outer surface and in the intaglio pattern, wherein the activated layer completely covers the outer surface and all surfaces of the intaglio pattern; removing the activated layer on the outer surface, and remaining the activated layer in the intaglio pattern; forming a conductive material in the intaglio pattern by using a chemical deposition method after removing the activated layer on the outer surface, wherein the activated layer involves in chemical reactions of the chemical deposition method; and removing the barrier layer and the film after forming the conductive material, wherein the barrier layer is a metal layer, and a method for forming the barrier layer comprises depositing the metal layer on the film. ### Claim 2 (depends on 1) The method for manufacturing a wiring structure of a wiring board according to claim 1, wherein the chemical deposition method is a chemical vapor deposition (CVD). ### Claim 3 (depends on 1) The method for manufacturing a wiring structure of a wiring board according to claim 1, wherein a method for removing the activated layer on the outer surface is an etching. ### Claim 4 (depends on 1) The method for manufacturing a wiring structure of a wiring board according to claim 1, wherein a method for removing the barrier layer and the film is an etching. ### Claim 5 (depends on 1) The method for manufacturing a wiring structure of a wiring board according to claim 1, wherein the film is a metal layer, and a method for forming the substrate comprises depositing the metal layer on the insulation layer. ### Claim 6 (depends on 1) The method for manufacturing a wiring structure of a wiring board according to claim 1, wherein a method for forming the substrate comprises: laminating a metal foil on the insulation layer; and reducing a thickness of the metal foil, after laminating the metal foil. ### Claim 7 (depends on 1) The method for manufacturing a wiring structure of a wiring board according to claim 1, wherein a method for forming the intaglio pattern comprises performing laser ablation or plasma etching to the substrate. ### Claim 8 (depends on 1) The method for manufacturing a wiring structure of a wiring board according to claim 1, wherein the process of forming the intaglio pattern comprises forming a plurality of trenches partially exposing the insulation layer on the outer surface. ### Claim 9 (depends on 1) The method for manufacturing a wiring structure of a wiring board according to claim 1, wherein the chemical deposition method comprises an electroless plating. ### Claim 10 (depends on 9) The method for manufacturing a wiring structure of a wiring board according to claim 9, wherein the chemical deposition method further comprises an electroplating. ### Claim 11 (depends on 1) The method for manufacturing a wiring structure of a wiring board according to claim 1, wherein a method for forming the activated layer comprises dipping the barrier layer and the insulation layer into an ionic solution containing a plurality of metal ions. ### Claim 12 (depends on 11) The method for manufacturing a wiring structure of a wiring board according to claim 11, wherein the metal ions are nickel ions, palladium ions, platinum ions, chromium ions, silver ions, or molybdenum ions. ### Claim 13 (depends on 1) The method for manufacturing a wiring structure of a wiring board according to claim 1, wherein the substrate further comprises a wiring layer, the wiring layer is located on a position opposite to the film, and the insulation layer covers the wiring layer. ### Claim 14 (depends on 13) The method for manufacturing a wiring structure of a wiring board according to claim 13, wherein the substrate further comprises an inner wiring substrate, both the insulation layer and the wiring layer are disposed on the inner wiring substrate, and the wiring layer is electrically connected to the inner wiring substrate. ### Claim 15 (depends on 13) The method for manufacturing a wiring structure of a wiring board according to claim 13, wherein the process of forming the intaglio pattern comprises forming at least one blind via partially exposing the wiring layer. ### Claim 16 (depends on 15) The method for manufacturing a wiring structure of a wiring board according to claim 15, wherein the process of forming the conductive material comprises forming a conductive post in the blind via. ### Claim 17 (depends on 16) The method for manufacturing a wiring structure of a wiring board according to claim 16, wherein the blind via is filled with the conductive post.