Method for manufacturing PCB and PCB manufactured using the same

A method of manufacturing a printed circuit board, the printed circuit board comprising a copper clad laminate 41 including an insulated substrate 41a and pieces of copper foil 41b applied on both sides of the insulated substrate 41a, comprising the steps in order of:

• (a) forming first plating layers 42 on the pieces of copper foil 41b by performing electroless copper plating after drilling, and then forming second plating layers 43 on the first plating layers 42 by performing electrolytic plating;
• (b) adhering dry films 44 on the second plating layers 43, and then exposing and developing the dry films 44, thereby forming dot circuit forming portions 45;
• (c) forming copper plating layers 46 by performing electrolytic copper plating in the dot circuit forming portions 45, and then removing the photosensitive dry films 44 other than the copper plating layers 46 through a stripping process, thereby forming dot circuits 46a;
• (d) further adhering dry films 47 including a photosensitizing agent on the dot circuits 46a, forming etching resists 47a by exposing and developing the dry films 47, and then forming external circuits 43a having a larger width than the dot circuits 46a by etching the second plating layers 43;
• (e) removing the dry films 47a, used as the etching resist, through a stripping process after formation of the external circuits 43a;
• and
• (f) forming second metal layers 49 by performing electroless or electrolytic plating in order to improve conductivity of the dot circuits 46a and external circuits 43a.