Copper filling-up method
AssigneesOsaka Prefecture University Public Corporation, Nitto Boseki Co., Ltd.
InventorsNaoki Okamoto, Kazuo Kondo, Hideyuki Kuri, Masaru Bunya, Minoru Takeuchi
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Abstract
A method of filling copper in a non-through hole on a substrate that has been treated to render it conductive, which comprises plating said substrate in an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid and a filling additive that is a polymer having the activities of both of a brightener and a leveler.
Claims7
A method of filling copper in a non-through hole on a substrate that has been treated to render it conductive, the method comprises plating said substrate in an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid and a filling additive that is a polymer having the activities of both of a brightener and a leveler, wherein said filling additive is a copolymer of diallylmethylamine addition salt and sulfur dioxide, the copolymer comprising a diallylmethylamine addition salt constituent unit of the general formula (I),
- wherein X− is a counter ion,
- and a sulfur dioxide constituent unit of the formula (II),
Dependencies are inferred from the claim text.