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US 8,268,699 B2Granted
Wafer structures and wafer bonding methods
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-Joon Park, Kyoung-Kook Kim, Yu-Sik Kim
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Abstract
Wafer structures and wafer bonding methods are provided. In some embodiments, a wafer bonding method includes providing a conductive wafer and a plurality of insulating wafers, the conductive wafer being larger than the insulating wafers; performing a pre-treatment operation on the conductive wafer, the insulating wafers, or both; and directly bonding the insulating wafers to the conductive wafer.
Claims11
A wafer bonding method comprising:
- providing a conductive wafer and a plurality of insulating wafers, the conductive wafer being larger than the insulating wafers;
- performing a plasma treatment operation on the conductive wafer, the insulating wafers, or both;
- and
- directly bonding the insulating wafers to the conductive wafer.
1 more element
Dependencies are inferred from the claim text.