Bonding system for optical alignment
AssigneesIndustrial Technology Research Institute, Elite Advanced Laser Corporation
InventorsChih-Tsung Shih, Chien-Jen Sun, Jerry Chien, Chu-Liang Cheng, Yi-Jen Chan
Life of this patent
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Abstract
A bonding system and a bonding method for alignment are provided. An optical semiconductor includes a light source and a plurality of protruded elements on a surface thereof. A semiconductor bench includes a light receiving element and a plurality of recess elements on a surface thereof. A sidewall of the protruded elements or a sidewall of the recess elements is slanted. A first metallized layer is disposed on a bonding surface of each protruded element and a second metallized layer is disposed on a bottom surface of each recess element, wherein the first metallized layer is used for bonding with the second metallized layer.
Claims24
A bonding system for alignment, comprising:
- an optical semiconductor, comprising:
- a light source;
- and
- a plurality of protruded elements extending above a surface of the optical semiconductor;
- a first metallized layer disposed on a surface of each protruded element of the plurality of protruded elements;
- and
- a semiconductor bench, comprising:
- a light receiving element, serving as an input terminal of the light source, wherein the light receiving element is aligned to the light source in a pressure applying direction;
- a plurality of recess elements extending downward from a surface of the semiconductor bench, wherein at least a sidewall of each protruded element of the plurality of protruded elements or a sidewall of each recess element of the plurality of recess elements is slanted;
- a second metallized layer disposed at a bottom surface of each recess element of the plurality of recess elements,
- wherein the optical semiconductor is integrated with the semiconductor bench by sliding the plurality of protruded elements correspondingly into the plurality of recess elements and by fusing the first metallized layer with the second metallized layer.
A bonding method for optically coupling an optoelectronic device to an optical waveguide, the method comprising:
- providing an optical semiconductor comprising a light emission element;
- forming a plurality of protruded structures extending above a surface of the optical semiconductor, wherein a first metallized layer is formed on a surface of each protruded structure of the plurality of protruded structures;
- providing a semiconductor bench comprising a light receiving element;
- forming a plurality of recess elements on a surface of the semiconductor bench, wherein a second metallized layer is formed on a surface of each recess element, wherein at least a sidewall of each protruded element of the plurality of protruded elements or a sidewall of each recess element of the plurality of recess elements is slanted;
- placing the optical semiconductor above the semiconductor bench and applying a force such that the plurality of protruded structures slides into the plurality of recess elements, respectively, wherein the light receiving element is aligned to the light emission element in a direction where the force is applied;
- and
- performing a bonding process for bonding the first metallized layer and the second metallized layer together.
A bonding system for alignment, comprising:
- an optical semiconductor, comprising:
- a light source;
- and
- a plurality of recess elements extending downward from a surface of the optical semiconductor;
- a first metallized layer disposed on a surface of each recess element of the plurality of recess elements;
- and
- a semiconductor bench, comprising:
- a light receiving element, serving as an input terminal of the light source, wherein the light receiving element is aligned to the light source in a pressure applying direction;
- a plurality of protruded elements extending above a surface of the semiconductor bench, wherein at least a sidewall of each protruded element of the plurality of protruded elements or a sidewall of the each recess element of the plurality of recess elements is slanted;
- a second metallized layer disposed at a bottom surface of the each recess element of the plurality of recess elements,
- wherein the optical semiconductor is integrated with the semiconductor bench by sliding the plurality of protruded elements correspondingly into the plurality of recess elements and by fusing the first metallized layer with the second metallized layer.
Dependencies are inferred from the claim text.