Back to results
US 8,264,881 B2Granted
Semiconductor memory including pads coupled to each other
AssigneeFujitsu Semiconductor Limited
InventorsHiroyuki Kobayashi, Toshiya Uchida
Life of this patent
Estimating the term…
Abstract
A semiconductor memory is provided which includes: a first pad; a second pad disposed adjacent to the first pad; a first output buffer coupled to the first pad; and a second output buffer coupled to the second pad. The first pad is coupled to the second pad by metal.
Claims7
A semiconductor memory chip, comprising:
- a first pad on the semiconductor memory chip;
- a second pad disposed on the semiconductor memory chip and adjacent to the first pad;
- a first output buffer coupled to the first pad;
- and
- a second output buffer coupled to the second pad,
- wherein the first pad is coupled to the second pad by metal on the semiconductor memory chip.
3 more elements
Dependencies are inferred from the claim text.