3D electronic module

A 3D electronic module comprising:

• a stack having a first slice and a second slice,
• wherein each of the first and second slices has
• several electronic components;
• an electrically insulating resin clad with the electronic components;
• and
• electrical connection elements on a face of the slice,
• wherein the first slice further includes, on said face of the first slice,
• a set of electrically conductive protrusions, and
• an electrically conductive track,
• wherein at least one of said electrical connection elements is connected to the set of electrically conductive protrusions via the electrically conductive track,
• wherein the first slice has, between two of the electronic components, a zone of electrically insulating material, traversing a thickness of the first slice,
• wherein the second slice has
• a zone of electrically insulating material traversing a thickness of the second slice, and
• an electrically conductive element traversing said second slice in the zone of electrically insulating material, and
• wherein the electrically conductive element and the electrically conductive protrusions are respectively constituted by a material having a specified hardness, the hardness of the material of the electrically conductive element being less than that of the material of the electrically conductive protrusions, and
• wherein the set of the electrically conductive protrusions of the first slice is embedded into the electrically conductive element of the second slice.