E-ink display device and method for manufacturing the same

A method for manufacturing an E-ink display device, comprising:

• providing an active element array substrate having a surface, the surface including a contacting region and a sealing region;
• cutting an E-ink layer and a protective layer, such that the E-ink layer has a first side wall and the protective layer has a second side wall;
• disposing the E-ink layer on the contacting region, a first included angle defined between the first side wall and the surface being smaller than 90 degrees or larger than 90 degrees;
• disposing the protective layer on the E-ink layer, a second included angle defined between the second side wall and the surface being smaller than 90 degrees or larger than 90 degrees;
• and
• forming a sealant on the sealing region to surround the E-ink layer and the protective layer.

An E-ink display device, comprising:

• an active element array substrate having a surface, the surface including a contacting region and a sealing region;
• an E-ink layer disposed on the contacting region and having a first side wall and a first surface, a first included angle defined between the first side wall and the surface being smaller than 90 degrees or larger than 90 degrees;
• a protective layer disposed on the first surface of the E-ink layer and having a second surface, an area of the second surface being larger than that of the first surface, a portion of the second surface being in contact with the first surface;
• and
• a sealant disposed on the sealing region and surrounding the E-ink layer and the protective layer.

A method for manufacturing an E-ink display device, comprising:

• providing an active element array substrate having a surface, the surface including a contacting region and a sealing region;
• cutting an E-ink layer to make the E-ink layer have a first side wall;
• disposing the E-ink layer on the contacting region, a first included angle defined between the first side wall and the surface being smaller than 90 degrees or larger than 90 degrees;
• disposing the protective layer on a first surface of the E-ink layer, the protective layer having a second surface, an area of the second surface being larger than that of the first surface, a portion of the second surface being in contact with the first surface;
• and
• forming a sealant on the sealing region to surround the E-ink layer and the protective layer.