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US 8,264,248 B2Granted
Micro probe assembly
AssigneeDSL Labs, Incorporated
InventorFrancis T McQuade
Life of this patent
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Abstract
Embodiments of the present invention improve probes and probe assemblies. In one embodiment, the present invention includes a probe test head comprising a plurality of novel probes inserted in an array of holes in upper and lower dies of the assembly. The novel assembly includes a novel alignment layer for easy repair and maintenance of the probes.
Claims5
A test assembly comprising:
- a plurality of micro probes, wherein one of said micro probes includes only one angle stop connected to a linear region and a curved region, wherein said linear region is shorter than said curved region, wherein said linear region includes a first contact end configured for providing electrical contact to a solder bump on a semiconductor wafer, wherein said curved region includes a second contact end configured for providing electrical contact to an electronic test circuitry, wherein said linear and curved regions have a uniform thickness;
- a first planar board having a plurality of holes formed therein, wherein one of said holes is configured for receiving said curved region of said one micro probe;
- and
- a second planar board having a plurality of holes formed therein, wherein one of said holes is configured for receiving said linear region of said one micro probe at said angle stop.
1 more element
Dependencies are inferred from the claim text.