Device and system for measuring material thickness

A piezoelectric sensing device, comprising:

• a substrate;
• a solder layer disposed on the substrate;
• and
• a piezoelectric element coupled to the substrate via the solder layer, the piezoelectric element comprising a ceramic;
• wherein the substrate, the solder layer, and the piezoelectric element are arranged as a layered structure that has a profile height that does not exceed 3 mm,
• wherein the substrate comprises a material that is compatible with operating temperatures in excess of 120° C. and
• wherein the substrate comprises an area with an electrode that has a t-shaped geometry, and wherein the piezoelectric element is secured to the area with the solder layer.

A measurement system for measuring material thickness of a target, said measurement system comprising:

• a substrate comprising a flexible circuit material having an area with an electrode with a t-shaped geometry;
• a solder layer disposed on the electrode;
• a piezoelectric element disposed on the solder layer, the piezoelectric element comprising a ceramic body having a first electrode, a second electrode, and a wrap tab that is coupled to each of the first electrode and the second electrode;
• and
• a connection for conducting inputs and outputs to and from the piezoelectric element, wherein the flexible circuit material, the solder layer, and the piezoelectric element are arranged as a layered structure that has a profile height that does not exceed 3 mm.