Piezoelectric component and manufacturing method thereof

A piezoelectric component comprising:

• a piezoelectric substrate;
• a piezoelectric device formed on a principle surface of the piezoelectric substrate;
• a device wiring section formed on a principle surface of said piezoelectric substrate;
• a protective film that has a terminal electrode connected to the wiring section and is formed on an upper surface of said wiring section;
• a rewiring layer that is further formed on an upper surface of the protective film and is connected to a wiring section of an electrode, which is different from said electrode;
• a buffer layer that is composed of an inorganic material and that covers an entire upper surface of the rewiring layer excluding said piezoelectric device;
• an outer periphery wall layer that is composed of a photosensitive resin and is formed on an upper surface of the buffer layer;
• a ceiling layer that is composed of a photosensitive resin film having 10 to 45% by weight of a mica filler added thereto and that is formed on an upper surface of the outer periphery wall layer;
• and
• a through electrode that is formed so as to pass through said ceiling layer and said outer periphery wall layer;
• to thereby a hollow section that accommodates said piezoelectric device is formed between said outer periphery wall layer, said ceiling layer, and a principle surface of said piezoelectric substrate.

A manufacturing method of a piezoelectric component comprising:

• an aggregate piezoelectric substrate;
• a piezoelectric device formed on a principle surface of the aggregate piezoelectric substrate;
• a wiring section formed on said aggregate piezoelectric substrate;
• a through electrode that is formed on said aggregate piezoelectric substrate and is connected to the wiring section;
• and
• a hollow structure section that is provided so as to surround an upper surface of said piezoelectric device, said method including the steps of:
• laminating a photosensitive resin film on the principle surface of said aggregate piezoelectric substrate to thereby form an outer periphery wall layer that surrounds said piezoelectric device formed on the principle surface of said aggregate piezoelectric substrate;
• laminating a photosensitive resin film having a mica filler added thereto on an upper surface of the outer periphery wall layer to thereby form a first ceiling layer;
• installing a mesh-shaped member composed of an insulating material on an upper surface of the first ceiling layer;
• and
• laminating a photosensitive resin film having a mica filler added thereto on an upper surface of the installed mesh-shaped member to thereby form a second ceiling layer, and resin-ceiling said mesh-shaped member in between said first and second ceiling layers.