Semiconductor device including offset bonding pad and inspection method therefor

A semiconductor device, comprising:

• a plurality of circuit blocks, a circuit block of the plurality of circuit blocks being formed in a peripheral edge portion of a semiconductor chip;
• a circuit block pad formed on the circuit block providing an electrical connection for the circuit block;
• at least one fill block to fill in a gap between two adjacent circuit blocks of the plurality of circuit blocks;
• and
• a bonding pad laterally offset from the circuit block and the circuit block pad, the bonding pad being electrically connected to the circuit block pad and serving as a bonding wire pad for the circuit block, the laterally offset bonding pad thereby functioning as a substitute wire bonding pad for the circuit block,
• wherein the bonding pad is laterally offset from the circuit block pad in a direction of a nearest corner of the semiconductor chip,
• wherein the corner of the semiconductor chip comprises a portion of the peripheral edge portion of the semiconductor chip wherein no circuit blocks are formed, and the laterally offset bonding pad is thereby not formed on a circuit block,
• wherein the plurality of circuit blocks are formed in the peripheral edge portion of the semiconductor chip,
• wherein circuit blocks of the plurality of circuit blocks not adjacent to the corner of the semiconductor chip include a circuit block pad formed thereon that does not have an associated laterally offset bonding pad, and
• wherein each fill block is formed at a position farther away from a corner of the semiconductor chip than the circuit block.