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US 8,264,089 B2Granted
Enhanced WLP for superior temp cycling, drop test and high current applications
AssigneeMaxim Integrated Products, Inc.
InventorsRey Alvarado, Tie Wang, Arkadii Samoilov
Life of this patent
Estimating the term…
Abstract
A WLP device is provided with a flange shaped UBM or an embedded partial solder ball UBM on top of a copper post style circuit connection.
Claims13
A WLP comprising:
- a WLP die comprising a circuit side;
- a copper post comprising a post width and having a post length from a first post end to a second post end, the copper post being attached at the first post end to a WLP circuit connection location on the circuit side;
- a first metal layer comprising a flared portion having a narrow end and a wide end, the narrow end having a narrow width equal to the post width, the narrow end being set to and aligned with the second post end;
- a first encapsulant layer substantially covering the circuit side, the copper post and a portion of the narrow end of the first metal layer such that the wide end extends over the first encapsulant layer;
- a second encapsulant layer on the first encapsulant layer, the second encapsulant layer being covering the first metal layer such that the first metal layer is embedded in the second encapsulant layer, a top surface of the second encapsulant layer being substantially co-planar with a top side of the wide end;
- and
- a solder ball attached to the top side of the wide end of the first metal layer.
4 more elements
A wafer level package (WLP) device comprising:
- a die comprising a circuit side including a circuit connection location;
- a copper post comprising a first post end and a second post end, the copper post attached at the first post end to the circuit connection location;
- a metal layer comprising a flared portion having a narrow end and a wide end, the narrow end attached to the copper post at the second post end and the wide end having a top side;
- a first encapsulant layer at least substantially covering the circuit side, the copper post, and a portion of the narrow end of the metal layer so that the wide end extends over the first encapsulant layer;
- a second encapsulant layer disposed over the first encapsulant layer and the metal layer so that the metal layer is at least substantially embedded in the second encapsulant layer, a top surface of the second encapsulant layer being at least substantially co-planar with the top side of the second end of the metal layer;
- and
- a solder bump disposed on the top side of the second end of the metal layer.
4 more elements
Dependencies are inferred from the claim text.