Stacked-die package including substrate-ground coupling
AssigneeAtmel Corporation
InventorKen M. Lam
Life of this patent
Estimating the term…
Abstract
Method and apparatus are provided for semiconductor device packages. In an example, an apparatus can include a first semiconductor device, a ground pad situated on an uppermost portion of the first semiconductor device and configured to electrically couple portions of the first semiconductor device to aground potential, and a second semiconductor device having at least a portion in electrical communication with an uppermost face of the first semiconductor device through a first electrically-conductive adhesive. In an example, the first electrically-conductive adhesive can be electrically coupled to the ground bond pad on the first semiconductor device.
Claims9
An apparatus comprising:
- a first semiconductor device;
- a ground pad situated on an uppermost portion of the first semiconductor device and configured to electrically couple portions of the first semiconductor device to a ground potential;
- and
- a second semiconductor device having at least a portion in electrical communication with an uppermost face of the first semiconductor device through a first electrically-conductive adhesive, wherein the first electrically-conductive adhesive is electrically coupled to the ground bond pad on the first semiconductor device, and wherein the first electrically-conductive adhesive physically contacts the ground bond pad on the first semiconductor device.
Dependencies are inferred from the claim text.