Electronic device
AssigneeInfineon Technologies AG
InventorsManfred Schneegans, Holger Torwesten
Life of this patent
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Abstract
An electronic device is disclosed. In one embodiment, the electronic device includes a substrate, a plurality of conducting lines formed on a first conducting material that is disposed on the substrate, and a layer of a second conducting material disposed on the plurality of conducting lines. The conducting lines include a top face and a side face. The layer of the second conducting material includes a first thickness disposed on each of the top faces and a second thickness disposed on each of the side faces. To this end, the first thickness is greater than the second thickness.
Claims16
An electronic device comprising:
- a substrate;
- a plurality of conducting lines formed on a first conducting material disposed on the substrate, the conducting lines including a top face and a side face;
- and
- a layer of a second conducting material disposed on the plurality of conducting lines, the layer comprising a first thickness disposed on each of the top faces and a second thickness disposed on each of the side faces;
- wherein the second thickness is substantially uniform between 0.1 and 1.0 micrometers and the first thickness is at least twice the second thickness, and wherein the second conducting material has a hardness greater than a hardness of a material from which the plurality of conducting lines is formed.
A semiconductor package comprising:
- a carrier;
- and
- a chip attached to the carrier, the chip including:
- a chip substrate,
- a first conducting material disposed on the chip substrate,
- at least one conducting line formed on the first conducting material, each conducting line including a top face and a side face,
- a layer of a second conducting material disposed on the at least one conducting line, the layer comprising a first thickness disposed on each of the top faces and a second thickness disposed on each of the side faces;
- wherein the second thickness is substantially uniform between 0.1 and 1.0 micrometers and the first thickness is at least twice the second thickness, and wherein the second conducting material has a hardness greater than a hardness of a material from which the plurality of conducting lines is formed.
An electronic device comprising:
- a substrate;
- a first conducting material disposed on the substrate;
- a plurality of conducting lines formed on the first conducting material, the conducting lines including a top face and a side face;
- and
- means for conformally coating each of the top faces and each of the side faces with a layer configured to minimize oxidation of the conducting lines, wherein a material from which the layer is formed has a hardness greater than a hardness of a material from which the plurality of conducting lines is formed, and wherein the layer a first thickness on each of the top faces and a second thickness on each of the side faces with the second thickness being substantially uniform between 0.1 and 1.0 micrometers and the first thickness being at least twice the thickness.
An electronic device comprising:
- a substrate;
- and
- a plurality of conducting lines formed atop the substrate, the conducting lines including a top surface opposite a bottom surface and side faces extending between the top and bottom surfaces;
- wherein a first conducting material deposited between the substrate and the bottom surface of each of the conducting lines and a layer of a second conducting material disposed on the top surface and the side faces of each of the conducting lines, wherein the second conducting material has a hardness greater than a hardness of a material from which the plurality of conducting lines is formed, and wherein the second conducting material has a thickness substantially uniform on the side faces between 0.1 and 1.0 micrometers and a thickness on the top surface at least twice the thickness as on the side faces.
Dependencies are inferred from the claim text.