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US 8,264,046 B2Granted
Synergy effect of alloying materials in interconnect structures
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHui-Lin Chang, Yung-Cheng Lu, Syun-Ming Jang
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Abstract
A method of forming an integrated circuit structure, the method includes providing a semiconductor substrate; forming a dielectric layer over the semiconductor substrate; forming an opening in the dielectric layer; forming a seed layer in the opening; forming a copper line on the seed layer, wherein at least one of the seed layer and the copper line includes an alloying material; and forming an etch stop layer on the copper line.
Claims10
An integrated circuit structure comprising:
- a semiconductor substrate;
- a first dielectric layer over the semiconductor substrate;
- an opening in the first dielectric layer;
- a copper line filling the opening;
- a second dielectric layer over the copper line;
- and
- an interface region between and abutting the copper line and the second dielectric layer, wherein the interface region comprises an alloy comprising a non-copper alloying material, and an element selected from the group consisting essentially of silicon, germanium, and combinations thereof.
4 more elements
An integrated circuit structure comprising:
- a semiconductor substrate;
- a first dielectric layer over the semiconductor substrate;
- an opening in the first dielectric layer;
- a seed layer in the opening;
- a copper line in the opening and over the seed layer, wherein a non-copper alloying material in the seed layer has a first weight percentage greater than a second percentage of the non-copper alloying material in the copper line;
- a second dielectric layer over the copper line;
- and
- an interface region between and abutting the copper line and the second dielectric layer, wherein the interface region comprises an alloy formed of the non-copper alloying material and an element selected from the group consisting essentially of silicon, germanium, and combinations thereof.
5 more elements
Dependencies are inferred from the claim text.