US 8,264,010 B2 · Layout for high density conductive interconnects

Abstract

In one embodiment of the present invention, a method for connecting a plurality of bit lines to sense circuitry comprises providing a plurality of bit lines extending from a memory array in a first metal layer. The plurality of bit lines are separated from each other by an average spacing x in a first region of the first metal layer. The method further comprises elevating a portion of the plurality of bit lines into a second metal layer overlying the first metal layer. The elevated bit lines are separated from each other by an average spacing y in the second metal layer, with y>x. The method further comprises extending a portion of the plurality of bit lines into a second region of the first metal layer. The extended bit lines are separated from each other by an average spacing z in the second region of the first metal layer, with z>x. The method further comprises connecting a bit line in the second metal layer and a bit line in the first metal layer to the sense circuitry.

Claims9

Dependent claims

An integrated circuit, comprising:

a plurality of conductive interconnects extending out of an array region on a first level,
wherein, outside of the array region, some of the conductive interconnects extend to a second level that is vertically separated from the first level,
wherein the some of the conductive interconnects extend across an area of the integrated circuit on the second level,
wherein the some of the conductive interconnects extend back to the first level at an end of the area, and
wherein other of the conductive interconnects remain on the first level;
and
sense circuitry comprising a multiplexer and a sense amplifier connected to an output of the multiplexer, wherein the some and the other of the conductive interconnects electrically connect to the sense circuitry, wherein the sense circuitry is disposed on the first level.

4 more elements

Dependencies are inferred from the claim text.

Layout for high density conductive interconnects

Life of this patent

Layout for high density conductive interconnects

Life of this patent

Abstract

Claims9