LED package
AssigneeFoxsemicon Integrated Technology, Inc.
InventorsYing-Chieh Lu, Kuo-Feng Chiang, Zheng-Jay Huang, Kuo-Mang Lo, Hsin-Fei Huang, Yu-Shu Chen
Life of this patent
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Abstract
A LED package includes a substrate, at least one LED chip, a transparent adhesive and a lens. The at least one LED chip is mounted on the substrate. The transparent adhesive is filled between the LED chip and the lens. A number of through holes is regularly defined in an optical non-effective portion of the lens. The through holes are configured for increasing the air convection between inside and outside of the lens.
Claims9
A LED package comprising:
- a substrate;
- at least one LED chip mounted on the substrate;
- a transparent adhesive;
- and
- a lens over the at least one LED chip, the transparent adhesive filled between the at least one LED chip and the lens, wherein a plurality of through holes is regularly defined in an optical non-effective portion of the lens, the through holes configured for increasing the air convection between inside and outside of the lens, light generated by the at least one LED chip travelling out of the LED package first through the transparent adhesive and then the lens.
The LED package as claimed in clam 1, wherein a plurality of cooling fins extends downwardly from a bottom of the substrate.
Dependencies are inferred from the claim text.