Laminated structure and image display device

A laminated structure comprising:

• a substrate;
• a wettability variable layer formed on the substrate, comprising a material whose critical surface tension varies by receiving energy so as to change from a low surface energy state to a high surface energy state, wherein high surface energy regions, generated by receiving the energy, and low surface energy regions are formed on the wettability variable layer;
• a conductive layer formed in one of the high surface energy regions on the wettability variable layer;
• and
• an insulating layer formed in such a manner as to cover the conductive layer, wherein,
• another one of the high surface energy regions is formed on the wettability variable layer in such a manner as to surround a periphery of a circuit formation region in which a plurality of the conductive layers are formed;
• and
• a metal layer made of the same material as that of the conductive layer is formed in the other one of the high surface energy regions so that an adhesive guard ring region is formed between the wettability variable layer and the metal layer.

An image display device comprising:

• a semiconductor device;
• and
• an image display element configured to display an image, wherein the semiconductor device comprises:
• a laminated structure;
• a semiconductor layer;
• and
• an insulating film, wherein the laminated structure comprises:
• a substrate;
• a wettability variable layer formed on the substrate, comprising a material whose critical surface tension varies by receiving energy so as to change from a low surface energy state to a high surface energy state, wherein high surface energy regions, generated by receiving the energy, and low surface energy regions are formed on the wettability variable layer;
• a conductive layer formed in one of the high surface energy regions on the wettability variable layer;
• and
• an insulating layer formed in such a manner as to cover the conductive layer, wherein,
• another one of the high surface energy regions is formed on the wettability variable layer in such a manner as to surround a periphery of a circuit formation region in which a plurality of the conductive lavers are formed,
• the insulating layer is formed in such a manner as to also cover the other one of the high surface energy regions so that an adhesive guard ring region is formed between the wettability variable layer and the insulating layer,
• an additional one of the high surface energy regions is formed on the wettability variable layer inside a part surrounded by the adhesive guard ring region and where the conductive layer is not formed, and
• the insulating layer is formed in such a manner as to also cover the additional one of the high surface energy regions so that an adhesive reinforcing region is formed between the wettability variable layer and the insulating layer.