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US 8,263,877 B2Granted
Printed circuit board
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsChien-Hung Liu, Po-Chuan Hsieh, Yu-Chang Pai, Shou-Kuo Hsu
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Abstract
A printed circuit board includes a first signal layer, a second signal layer, and a dielectric layer sandwiched between the first signal layer and the second signal layer. The first signal layer includes two pads. The second signal layer includes two conducting pieces connected to two signal traces. The shape and material of the pads are the same as the shape and material of the conducting pieces. The projections of the pads on the second signal layer are overlapping with the conducting pieces.
Claims1
A printed circuit board (PCB) comprising:
- a first signal layer comprising at least one pad;
- a second signal layer comprising at least one conducting piece connected to at least one signal trace, wherein the number of the at least one pad is equal to the number of the at least one conducting piece, the shape and material of the at least one pad are the same as the shape and material of the at least one conducting piece, the projection of the at least one pad on the second signal layer is overlapping with the at least one conducting piece;
- and
- a dielectric layer sandwiched between the first signal layer and the second signal layer;
- wherein the at least one pad comprises two connector pads, the at least one conducting piece comprises two conducting pieces, and the at least one signal trace comprises a pair of differential signal traces.
2 more elements
Dependencies are inferred from the claim text.