Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same

A conductive substrate structure, comprising:

• a substrate unit having a top surface, a bottom surface opposite to the top surface, two opposite lateral surfaces between the top surface and the bottom surface, and a front surface between the top surface and the bottom surface and on two front sides of the two lateral surfaces, wherein each lateral surface of the substrate unit is divided into an upper portion and a lower portion, the area of upper portion of each lateral surface is smaller than that of the lower portion of each lateral surface, and the height of upper portion of each lateral surface is larger than that of the lower portion of each lateral surface;
• a conductive pad unit having at least two first conductive pads separated from each other and disposed on the top surface of the substrate unit and at least two second conductive pads separated from each other and disposed on the bottom surface of the substrate unit;
• and
• a conductive layer unit having at least two first conductive layers formed on the front surface of the substrate unit and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces of the substrate unit and respectively electrically connected to two opposite lateral sides of the two second conductive pads, wherein the two first conductive layers are respectively electrically connected with the two second conductive layers.

A conductive substrate structure, comprising:

• a substrate unit having a top surface, a bottom surface opposite to the top surface, two opposite lateral surfaces between the top surface and the bottom surface, a front surface between the top surface and the bottom surface and on two front sides of the two lateral surfaces, and a rear surface opposite to the front surface and formed between the top surface and the bottom surface and on two rear sides of the two lateral surfaces, wherein the rear surface of the substrate unit is divided into an upper portion and a lower portion, the area of the upper portion of the rear surface is larger than that of the lower portion of the rear surface, and the height of the upper portion of the rear surface is smaller than that of the lower portion of the rear surface;
• a conductive pad unit having at least two first conductive pads separated from each other and disposed on the top surface of the substrate unit and at least two second conductive pads separated from each other and disposed on the bottom surface of the substrate unit;
• and
• a conductive layer unit having at least two first conductive layers formed on the front surface of the substrate unit and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces of the substrate unit and respectively electrically connected to two opposite lateral sides of the two second conductive pads, wherein the two first conductive layers are respectively electrically connected with the two second conductive layers.