Surface mounting structure for a surface mounting electronic component
AssigneeKabushiki Kaisha Toyota Jidoshokki
InventorsTakamasa Nodo, Haruo Takagi
Life of this patent
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Abstract
A surface mounting structure for a surface mounting electronic component has an electronic component, a land, a wiring, and an electrical connection pattern. The electronic component has electrodes at opposite ends thereof. The land is connected to each electrode through a solder. The wiring is connected to the land and has a width which is smaller than a width of the electronic component in a width direction thereof. The wiring is connected to the electrical connection pattern. The electrical connection pattern has on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof.
Claims14
A surface mounting structure for a surface mounting electronic component, comprising:
- an electronic component having electrodes at opposite ends thereof, the electronic component being a chip component including a chip resistor and a chip capacitor;
- a land each of which is connected directly to the respective electrode of the electronic component by soldering;
- a wiring connected to the land, the wiring having a width which is smaller than a width of the electronic component in a width direction thereof;
- an electrical connection pattern having on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof;
- and
- a metal substrate on which the electronic component is mounted, the metal substrate on which the land, the wiring and the electrical connection pattern is formed,
- wherein the land includes a restriction portion for the solder to form thereon into a fillet which faces an end face of the electronic component in a direction perpendicular to the longitudinal direction of the electronic component, and which restricts movement of the electronic component in melting the solder, and a projection for the solder to form thereon into a fillet which faces a side face of the electronic component in the longitudinal direction of the electronic component, and the wiring is connected to the land at the projection.
Dependencies are inferred from the claim text.