Multilayer circuit board
AssigneeKYOCERA Corporation
InventorToshihiro Hashimoto
Life of this patent
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Abstract
A multilayer circuit board comprising low inductance through-conductors is disclosed. The multilayer circuit board comprises first ceramic substrate means, first layered section means, and second ceramic substrate means that allow insulation layers to be substantially thin, a length of through-conductors to be substantially short, and low relative permittivity of the insulation layers compared to resin insulation layers. Thus, increases in operation frequency of the multilayer circuit board are possible.
Claims17
A multilayer circuit board comprising:
- a first ceramic substrate comprising:
- a first ceramic layer;
- a plurality of first coupling pads located on the first ceramic layer;
- and
- a plurality of first through-conductors each electrically coupled to each of the first coupling pads respectively and penetrating the first ceramic layer;
- a first layered section located on the first ceramic substrate comprising:
- a plurality of first resin insulation layers;
- and
- a plurality of first conductive lines each electrically coupled to each of the first coupling pads respectively and penetrating the plurality of first resin insulating layers;
- and
- a second ceramic substrate located on the first layered section, comprising:
- a second ceramic layer;
- a plurality of second coupling pads located on the second ceramic layer;
- and
- a plurality of second through-conductors each electrically coupled to each of the first conductive lines respectively and penetrating the second ceramic layer.
A multilayer circuit board comprising:
- first ceramic substrate means including a first ceramic layer;
- a plurality of first coupling pads located on the first ceramic layer;
- and a plurality of first through-conductors each electrically coupled to each of the first coupling pads respectively and penetrating the first ceramic layer;
- first layered section means located on the first ceramic substrate and including a plurality of first resin insulation layers;
- and a plurality of first conductive lines each electrically coupled to the first coupling pads respectively and penetrating the plurality of first resin insulating layers;
- and second ceramic substrate means.
A method for producing a multilayer circuit board comprising:
- providing first ceramic substrate means including a first ceramic layer;
- a plurality of first coupling pads located on the first ceramic layer;
- and a plurality of first through-conductors each electrically coupled to each of the first coupling pads respectively and penetrating the first ceramic layer;
- providing first layered section means located on the first ceramic substrate means and including a plurality of first resin insulation layers;
- and a plurality of first conductive lines each electrically coupled to the first coupling pads respectively and penetrating the plurality of first resin insulating layers;
- and providing second ceramic substrate means located on the first layered section means.
Dependencies are inferred from the claim text.