Method and apparatus for attaching a flex circuit to a printed circuit board
AssigneeApple Inc.
InventorsKyle Yeates, Teodor Dabov, Stephen Brian Lynch
Life of this patent
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Abstract
Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI shielding can is arranged to support and/or spread forces involved in ACF bonding. The supports may be located proximate to the walls of the EMI shielding can, and positioned such that the supports effectively do not come into contact with components mounted on a PCB along with the EMI shielding can.
Claims21
An apparatus comprising:
- a printed circuit board (PCB);
- a flex circuit;
- an electromagnetic interference (EMI) shielding can, the EMI shielding can being mounted on the PCB, wherein the EMI shielding can includes a top surface, a first side wall, and a second side wall;
- and
- a shielding support, the shielding support being in contact with the PCB and located proximate to the first side wall, wherein the shielding support is arranged to support a load applied by an anisotropic conductive film (ACF) support head during an ACF process, the shielding support further being arranged to transfer the load such that an ACF bond may be formed between the PCB and the flex circuit.
An apparatus comprising:
- a printed circuit board (PCB);
- a flex circuit;
- an electromagnetic interference (EMI) shielding can, the EMI shielding can being mounted on the PCB, wherein the EMI shielding can includes a top surface, a first side wall, and a second side wall;
- a shielding support, the shielding support being in contact with the PCB and located proximate to the first side wall;
- and
- an anisotropic conductive film (ACF) bond that bonds together the PCB and the flex circuit.
Dependencies are inferred from the claim text.