Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board

A heat radiating wiring board having two generally planar parallel surfaces, comprising:

• a plurality of circuit patterns each comprising a metal wiring plate;
• a resin plate having insulating properties into which filler is mixed;
• and
• a heat sink, wherein:
• the circuit patterns are attached to one side surface of the resin plate,
• a top surface of the circuit pattern is exposed at the one side surface of the resin plate, and substantially flush with a top surface of the resin plate,
• the heat sink is attached to the other side surface of the resin plate,
• each circuit pattern of the circuit patterns is a single metal wiring plate, which has a thick portion and a thin portion thinner than the thick portion in a thickness direction of the resin plate, an inclined side surface connecting the thin portion and the thick portion in the circuit pattern,
• the inclined side surface having an inclination angle of more than zero degrees with respect to a plane perpendicular to the two generally planar surfaces of the wiring board, and
• a thickness of the resin plate between the thick portion and the heat sink is smaller than a thickness of the resin plate between the thin portion and the heat sink.